Temperature and humidity effects on microstructure and mechanical properties of an environmentally friendly Sn–Ag–Cu material
Author:
Funder
University of New South Wales
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s10853-019-03784-2.pdf
Reference47 articles.
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3. Gain AK, Fouzder T, Chan YC, Sharif A, Yung WKC (2010) Investigation of small Sn–3.5 Ag–0.5 Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads. J Alloys Compd 489:678–684
4. Ma H, Suhling JC (2009) A review of mechanical properties of lead-free solders for electronic packaging. J Mater Sci 44:1141–1158. https://doi.org/10.1007/s10853-008-3125-9
5. Chen G, Wu F, Liu C, Silberschmidt VV, Chan YC (2016) Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets. J Alloys Compd 656:500–509
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