Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti∕Cr-Cu∕Cu and Ni(P)∕Au metallization pads-Reference-Cited by-同舟云学术

Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti∕Cr-Cu∕Cu and Ni(P)∕Au metallization pads

Published:2004-10-15 Issue:8 Volume:96 Page:4518-4524
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Shao T. L.,Chen Y. H.,Chiu S. H.,Chen Chih

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.1788837

Reference15 articles.

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4. Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

5. J. D. Wu, P. H. Zheng, K. Lee, C. T. Chiu, and J. J. Lee, Proceedings of the 52nd Electronic Components and Technology Conference, ECTC 2002, San Diego, CA, 28 May 2002 (San Diego, CA, 2002) pp. 452–457.

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