Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2151255
Reference12 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects
2. S. Brandenburg and S. Yeh, in Proceedings of Surface Mount International Conference and Exhibition, San Jose, CA, 23–27 August 1998 (SMTA, Edina, MN, 1998), p. 337.
3. Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes
4. Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization
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