Investigation of pad wear in CMP with swing-arm conditioning and uniformity of material removal
Author:
Funder
National Research Foundation of Korea (NRF)
Ministry of Education
Korea Evaluation Institute of Industrial Technology
Publisher
Elsevier BV
Subject
General Engineering
Reference15 articles.
1. Mechanical aspects of the chemical mechanical polishing process: a review;Lee;Int J Precis Eng Manuf,2016
2. Mathematical model-based evaluation methodology for environmental burden of chemical mechanical planarization process;Lee;Int J Precis Eng Manuf-Green Technol,2014
3. Macroscopic and microscopic investigation on chemical mechanical polishing of sapphire wafer;Lee;J Nanosci Nanotechnol,2012
4. A theory of pad conditioning for chemical–mechanical polishing;Borucki;J Eng Math,2004
5. Enhancement of CMP pad lifetime for shallow trench isolation process using profile simulation;Lee;Curr Appl Phys,2009
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