Characterization and dressing effect of CMP diamond disc conditioner with ordered abrasive distribution-Reference-Cited by-同舟云学术

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Characterization and dressing effect of CMP diamond disc conditioner with ordered abrasive distribution

Published:2023-07-24 Issue:3-4 Volume:128 Page:1029-1048
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:en
Short-container-title:Int J Adv Manuf Technol

Author:

Guo Zhaozhi,Yang Songhao,Wen Zhenhui,Li Jingyu,Cheng Jun

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

https://link.springer.com/content/pdf/10.1007/s00170-023-11965-2.pdf

Reference24 articles.

1. Fujita T (2020) Evaluation of correlation between chemical modification state of pad and polishing rate in oxide chemical mechanical planarization. Thin Solid Films 709:138233

2. Lee H, Kim H, Jeong H (2021) Approaches to sustainability in chemical mechanical polishing (CMP): a review. Int J Precis Eng and Manuf-Green Tech 9:349–367

3. Shin C, Qin H, Hong S (2016) Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process. Mech Sci Technol 30(12):5659–5665

4. Son J, Lee H (2021) Contact-area-changeable CMP conditioning for enhancing pad lifetime. Appl Sci 11:21–35

5. Tseng WT, Boye C, Silvestre C, Chen JHC, li Lie F, Canaperi D (2021) CMP defect reduction and mitigation: practices and future trends. In: 2021 32nd annual SEMI advanced semiconductor manufacturing conference (ASMC), IEEE, pp 1–6

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