Author:
Lee Hyunseop,Lee Dasol,Jeong Haedo
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering
Reference99 articles.
1. Steigerwald, J. M., Murarka, S. P., and Gutmann, R. J., “Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, pp. 1–5, 1997.
2. Zantye, P. B., Kumar, A., and Sikder, A. K., “Chemical Mechanical Planarization for Microelectronics Applications, Materials Science and Engineering: R: Reports, Vol. 45, No. 3, pp. 89–220, 2004.
3. Lee, H., Kim, D., Jeong, H., and Kim, K., “Chemical Mechanical Polishing of a Ti-Si-N Nanocomposite and AFM Study on Its Nanostructure, Journal of the Korean Physical Society, Vol. 57, No. 4, pp. 845–849, 2010.
4. Xu, G., Liang, H., Zhao, J., and Li, Y., “Investigation of Copper Removal Mechanisms during CMP, Journal of the Electrochemical Society, Vol. 151, No. 10, pp. G688–G692, 2004.
5. Tseng, W. T., Chin, J. H., and Kang, L. C., “A Comparative Study on the Roles of Velocity in the Material Removal Rate during Chemical Mechanical Polishing, Journal of the Electrochemical Society, Vol. 146, No. 5, pp. 1952–1959, 1999.
Cited by
110 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献