A theory of pad conditioning for chemical-mechanical polishing-Reference-Cited by-同舟云学术

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A theory of pad conditioning for chemical-mechanical polishing

Published:2004-09 Issue:1 Volume:50 Page:1-24
ISSN:0022-0833
Container-title:Journal of Engineering Mathematics
language:en
Short-container-title:Journal of Engineering Mathematics

Author:

Borucki Leonard J.,Witelski Thomas,Please Colin,Kramer Peter R.,Schwendeman Donald

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Mathematics

Cited by 51 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A collocation grids method for determining pad conditioning coverage and density under long time conditioning process;Precision Engineering;2024-01

2. Modeling frictional precursory phenomena using a wear-based rate- and state-dependent friction model in the laboratory;Tectonophysics;2023-01

3. Modeling the microscale contact status in chemical mechanical polishing process;International Journal of Mechanical Sciences;2022-09

4. Diamond disc pad conditioning in chemical mechanical polishing;Advances in Chemical Mechanical Planarization (CMP);2022

5. Flexible Fiber Conditioner for Fine Conditioning of Polishing Pad and its Evaluation in Chemical Mechanical Polishing: Verification of SUS-FFC on Soft Urethane Foam Pad and Proposal of PEEK-FFC;International Journal of Automation Technology;2021-11-05

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