Development of Novel Conditioning Method Using Thermal Shape Memory Characteristics of Polyurethane CMP Pad

Author:

Seo Jangwon,Jeon Sanghuck,Yoon Jongwook,An Joonho,Choi Yongsoo,Seok Hyunho,Lee Seunghwan,Liu Pengzhan,Jeon Wookyung,Kim TaesungORCID

Abstract

Traditionally, the pad roughness has been maintained by wearing down the polyurethane pad with diamond disk. However, that method generates debris and reduces pad lifetime. This study propose a new approach to pad surface recovery by synthesizing a polyurethane-based raw material that exhibits shape memory behavior and can recover its shape upon heating. The findings suggest that the pad’s surface can be maintained by utilizing its shape memory trait and designing a system to heat the pad. The pad recovery tests were conducted using universal test machine (UTM) samples and found that, in terms of heat recovery, increasing the temperature had a greater effect than increasing the exposure time. CMP test was performed by using three conditioning potions: diamond disk conditioning, heat conditioning, and no conditioning. The results showed that pad asperity was recovered more efficiently with heat conditioning than with no conditioning (demonstrated by a 19% higher removal rate). The experimental results can be expected that combines diamond disk conditioning with heat conditioning could be a superior alternative for pad surface refreshment. Shape memory pads can return to their original form, leading to better chemical mechanical planarization (CMP) performance and an extended pad lifetime.

Funder

Ministry of Trade, Industry and Energy

Publisher

The Electrochemical Society

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