Manufacturing for Reliability of Panel-Level Fan-out Packages-Reference-Cited by-同舟云学术

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Manufacturing for Reliability of Panel-Level Fan-out Packages

Published:2022 Issue: Volume: Page:517-533
ISSN:
Container-title:Reliability of Organic Compounds in Microelectronics and Optoelectronics
language:
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Author:

Braun T.,Hölck O.

Publisher

Springer International Publishing

Link

https://link.springer.com/content/pdf/10.1007/978-3-030-81576-9_16

Reference32 articles.

1. T. Braun et al., Large area compression molding for fan-out panel level packing, in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), San Diego, CA, May 2015, pp. 1077–1083. https://doi.org/10.1109/ECTC.2015.7159728

2. T. Braun et al., Recent developments in panel level packaging, in 2018 International Wafer Level Packaging Conference (IWLPC), San Jose, CA, USA, October 2018, pp. 1–7. https://doi.org/10.23919/IWLPC.2018.8573277

3. T. Braun et al., Panel level packaging – a view along the process chain, in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, May 2018, pp. 70–78. https://doi.org/10.1109/ECTC.2018.00019

4. T. Braun et al., Fan-Out Wafer And Panel Level Technology For Advanced Led Packaging, presented at the IWLPC, San Jose, CA, USA, 2017

5. M. van Dijk et al., Simulation challenges of warpage for wafer- and panel level packaging, in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Cracow, Poland, July 2020, pp. 1–6. https://doi.org/10.1109/EuroSimE48426.2020.9152797

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. How to Manipulate Warpage in Fan-out Wafer and Panel Level Packaging;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. A Closer Look to Fan-out Panel Level Packaging;2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2023-03-07

3. Multiscale warpage behaviour in a Fan-Out Panel during thermal cycles;Microelectronics Reliability;2022-11

4. Panel Level Packaging – Where are the Technology Limits?;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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