Multiscale warpage behaviour in a Fan-Out Panel during thermal cycles-Reference-Cited by-同舟云学术

Multiscale warpage behaviour in a Fan-Out Panel during thermal cycles

Published:2022-11 Issue: Volume:138 Page:114641
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Hölck O.,Vernhes P.,Gamba B.,Cruz R.,Huber S.,Braun T.,Schneider-Ramelow M.

Funder

Electronic Components and Systems for European Leadership

ECSEL

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. Panel level packaging - a view along the process chain;Braun,2018

2. Manufacturing for reliability of panel-level fan-out packages;Braun,2022

3. The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods;Gadhiya,2020

4. Development of Fan-In WLP with mechanical protection and dynamic warpage characterization of eWLB;Campos,2015

5. Experimental study of panel level packaging warpage;Ecoiffier,2020

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A review on warpage measurement metrologies for advanced electronic packaging;Microelectronics Reliability;2024-09

2. How to Manipulate Warpage in Fan-out Wafer and Panel Level Packaging;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Warpage Optimization of Package Substrates Using Metamodels - A Review;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

4. Development and Demonstration on Process-Oriented Warpage Simulation Methodology of Fan-Out Panel-Level Package in Multilevel Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12

5. Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05