A Closer Look to Fan-out Panel Level Packaging-Reference-Cited by-同舟云学术

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A Closer Look to Fan-out Panel Level Packaging

Published:2023-03-07 Issue: Volume: Page:
ISSN:
Container-title:2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
language:
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Author:

Braun Tanja¹,Hölck Ole²,Voitel Marcus²,Obst Mattis¹,Voges Steve¹,Becker Karl-Friedrich¹,Aschenbrenner Rolf¹,Schneider-Ramelow Martin²

Affiliation:

1. Fraunhofer IZM,Germany

2. Technical University Berlin,Germany

Funder

German Federal Ministry of Education and Research

ECSEL Joint Undertaking (JU)

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10102927/10102928/10102969.pdf?arnumber=10102969

Reference5 articles.

1. Multiscale warpage behaviour in a Fan-Out Panel during thermal cycles

2. Panel Level Packaging - From Idea to Industrialization -

3. Manufacturing for Reliability of Panel-Level Fan-out Packages

4. Panel Level Packaging – Where are the Technology Limits?

5. Panel Level Packaging - A View Along the Process Chain

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. How to Manipulate Warpage in Fan-out Wafer and Panel Level Packaging;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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