Trends in Fan-out wafer and panel level packaging-Reference-Cited by-同舟云学术

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Trends in Fan-out wafer and panel level packaging

Published:2017-04 Issue: Volume: Page:
ISSN:
Container-title:2017 International Conference on Electronics Packaging (ICEP)
language:
Short-container-title:

Author:

Braun Tanja¹,Becker Karl-Friedrich¹,Wohrmann Markus²,Topper Michael¹,Bottcher Lars¹,Aschenbrenner Rolf¹,Lang Klaus-Dieter²

Affiliation:

1. Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

2. Technical University Berlin, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7934495/7939302/07939387.pdf?arnumber=7939387

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analyzing the Influence of RDL Stack-up on Wafer Warpage in FOWLP through Experimental and Numerical Investigations;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

3. Mold based D-band slotted SIW bandpass filter;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

4. Manufacturing for Reliability of Panel-Level Fan-out Packages;Reliability of Organic Compounds in Microelectronics and Optoelectronics;2022

5. A Quantitative Model to Understand the Effect of Gravity on the Warpage of Fan-Out Panel-Level Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-11

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