Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves
Author:
Affiliation:
1. Department of Materials Science and Engineering, Akita University, Tegatagakuen-cho 1-1, Akita 010-8502, Japan
2. Division of Human Mechanical Systems and Design, Hokkaido University, N13, W8, Kita-ku, Sapporo 060-8628, Japan
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4002911/5554701/041010_1.pdf
Reference22 articles.
1. Energy Approach to the Fatigue of 60/40 Solder: Part I—Influence of Temperature and Cycle Frequency;Solomon;ASME J. Electron. Packag.
2. Experimental Investigation of the Effects of Cycling Frequency and Temperature on the Fatigue Life of 60 Tin/40 Lead Solder;Leece;ASME J. Electron. Packag.
3. Prediction of Fatigue Failure of 60Sn–40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity;Ishikawa;ASME J. Electron. Packag.
4. A Theory of Fatigue: A Physical Approach With Application to Lead-Rich Solder;Wen;ASME J. Appl. Mech.
5. Inelastic Deformation and Fatigue of Solder Alloys Under Complicated Load Conditions;Liang;ASME J. Electron. Packag.
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading;Mechanical Engineering Journal;2019
2. Thermal deformation analysis of tabbed solar cells using solder alloy and conductive film;Journal of Mechanical Science and Technology;2016-07
3. Constitutive Modeling for SAC Lead-Free Solder based on Cyclic Loading Tests using Stepped Ramp Waves;Procedia Engineering;2011
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