Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading-Reference-Cited by-同舟云学术

Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading

Published:2019 Issue:5 Volume:6 Page:19-00137-19-00137
ISSN:2187-9745
Container-title:Mechanical Engineering Journal
language:en
Short-container-title:

Author:

OHGUCHI Ken-ichi¹,SASAKI Katsuhiko²,YUZE Yuki³,FUKUCHI Kohei¹

Affiliation:

1. Department of Materials Science, Graduate School of Engineering Science, Akita University

2. Faculty of Engineering, Hokkaido University

3. Graduate Student of Akita University

Publisher

Japan Society of Mechanical Engineers

Subject

General Medicine

Link

https://www.jstage.jst.go.jp/article/mej/6/5/6_19-00137/_pdf

Reference19 articles.

1. George, E., Osterman, M. and Pecht, M., An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model, Microelectronics Reliability, Vol. 55, No. 3-4, (2015), pp.582-587.

2. Kanchanomai, C., Miyashita, Y., Mutoh, Y. and Mannan, S.L., Influence of frequency on low cycle fatigue behavior of Pb-free solder 96.5Sn-3.5Ag, Materials Science and Engineering A, Vol.345, No. 1-2, (2003), pp.90-98.

3. Kariya, Y. and Otsuka, M., Effect of Bismuth on the Isothermal Fatigue Properties of Sn-3.5mass%Ag Solder Alloy, Journal of Electronic Materials, Vol. 27, No. 7, (1998), pp.866-870.

4. Kobayashi, T., Kobayashi, K., Mitsui, K. and Shohji, I., Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens, Advances in Materials Science and Engineering, Vol. 2018, (2018), DOI:10.1155/2018/1416942.

5. Mustafa, M., Suhling, J.C. and Lall, P., Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging, Microelectronics Reliability, Vol. 56, (2016), pp.136-147.

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