Affiliation:
1. Department of Civil Engineering, Northwestern University, 2145 Sheridan Road, Evanston, IL 60201
Abstract
A fatigue theory with its failure criterion based on physical damage mechanisms is presented for solders. The theory applies Mura’s micromechanical fatigue model to individual grains of the solder structure. By introducing grain orientation (Schmid factor m) into the fatigue formula, an m-N curve at constant loading, similar to a fatigue S-N curve, is suggested for fatigue failure of grains with different orientations. A solder structure is defined as fatigued when the ratio of its failed grains reaches a critical threshold, since at this threshold the failed grains may form a cluster, according to percolation theory. Experimental data for 96.5Pb-3.5Sn (wt. %) solder bulk specimens showed good agreement with the theory and its associated failure criterion. The theory is anisotropic, and there is no size limitation to its application, which could be suitable for anisotropic small-scale (micron scale or smaller) solder joints.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics
Reference38 articles.
1. SEMATECH, 1999, The International Technology Roadmap for Semiconductors: 1999 Edition, International SEMATECH, Austin, TX.
2. Lee, W. W., Nguyen, L. T., and Selvaduray, G. S., 2000, “Solder Joint Fatigue Models: Review and Applicability to Chip Scale Packages,” Microelectron. Reliab., 40, pp. 231–244.
3. Vaynman, S., and Zubelewicz, A., 1990, “Fatigue Life Prediction For Low-Tin Lead-Based Solder At Low Strains,” Weld. J. (Miami), 69, pp. S395–S398S395–S398.
4. Frear, D. R., Grivas, D., and Morris, J. W., 1988, “Thermal Fatigue in Solder Joints,” Journal of Metals 40, pp. 18–22.
5. Rathore, H. S., Yih, R. C., and Edenfeld, A. R., 1973, “Fatigue Behavior of Solders Used in Flip-Chip Technology,” J. Test. Eval., 1, pp. 170–178.
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