Thermal Fatigue in Solder Joints
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Engineering,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/BF03258168.pdf
Reference24 articles.
1. E. Levine and J. Ordenez, “Analysis of Thermal Cycle Fatigue Damage in Microsocket Solder Joints,” IEEE Trans Components, Hybrids, and Manufacturing Tech., CHMT-4 (1981) p. 515.
2. S.K. Kang, N.D. Zommer, D.L. Feucht and R.W. Heckel, “Thermal Fatigue Failure of Soft Soldered Contacts to Si Power Transistors,” IEEE Trans. Parts, Hybrids, and Packaging, PHP-13 (1977) p. 318.
3. J.T. Lynch, M.R. Ford and A. Boetti, “The Effect of High Dissipation Components on the Solder Joints of Ceramic Chip Carriers Attached to Thick Film Alumina Substrates,” IEEE Trans Components, Hybrids, and Manufacturing Tech., CHMT-6 (1983) p. 237.
4. J.W. Munford, “The Influence of Several Design and Material Variables on the Propensity for Solder Joint Cracking,” IEEE Trans. Parts, Hybrids, and Packaging, PHP-11 (1975) p. 296.
5. R.N. Wild, “Fatigue Properties of Solder Joints,” Welding Research Supp., 51 (1972) p. 521s.
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