Constitutive Modeling for SAC Lead-Free Solder based on Cyclic Loading Tests using Stepped Ramp Waves
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics
Reference3 articles.
1. Ohguchi, K., Sasaki, K., and Aso, S., 2009, “Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test,” ASME J. of Electronic Packaging, 131, pp. 021003-1-021003-7. in press.
2. Ohguchi, K. and Sasaki, K., 2010, “Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test using Stepped Ramp Waves” ASME J. of Electronic Packaging, 132, pp. 041003-1-041003-7. in press.
3. Ohguchi, K. and Sasaki, K., 2010, “Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading using Stepped Ramp Waves” ASME J. of Electronic Packaging, 132, pp. 041010-1-041010-7. in press.
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