A Review of TiO2-nanoparticle Reinforced Lead-Free Solder Composites Used in Electronic Components Soldering

Author:

Sarkar Montajar,Gulshan Fahmida,Rashid Abu Raihan Md. Harunur,Hasanuzzaman Muhammad

Publisher

Elsevier

Reference63 articles.

1. A review : Microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics;Aamir;Soldering and Surface Mount Technology,2020

2. Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy;Bogno;Journal of Materials Research and Technology,2015

3. Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3. 5AgXCu solder;Chang;Materials and Design,2011

4. Tio2 nanoparticles reinforced lead-free 96.5Sn-3.0Ag-0.5CU solder paste for ultra-fine package assembly in reflow soldering process;Cheani;Journal of Advanced Manufacturing Technology,2018

5. SAC-xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly;Cheani;Soldering and Surface Mount Technology,2018

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