Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test
Author:
Affiliation:
1. Department of Materials Science and Engineering, Akita University, Tegatagakuen-cho 1-1, Akita 010-8502, Japan
2. Division of Human Mechanical Systems and Design, Hokkaido University, N13 W8 Kita-ku, Sapporo 060-8628, Japan
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.3103951/5756201/021003_1.pdf
Reference23 articles.
1. Compression Stress-Strain and Creep Properties of the 52In–48Sn and 97In–3Ag Low-Temperature Pb-Free Solders;Vianco;J. Mater. Sci.: Mater. Electron.
2. Microstructure and Creep Behaviour of Eutectic SnAg and SnAgCu Solders;Wiese;Microelectron. Reliab.
3. Creep Behaviour of Lead Free and Lead Containing Solder Materials at High Homologous Temperatures With Regard to Small Solder Volumes;Villain;Sens. Actuators, A
4. Description of Temperature Dependence and Creep Deformation of 60Sn–40Pb Solder Alloys;Ohguchi;JSME Int. J., Ser. A
5. Prediction of Fatigue Failure of 60Sn–40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity;Ishikawa;ASME J. Electron. Packag.
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