Creep behaviour of lead free and lead containing solder materials at high homologous temperatures with regard to small solder volumes-Reference-Cited by-同舟云学术

Creep behaviour of lead free and lead containing solder materials at high homologous temperatures with regard to small solder volumes

Published:2002-04 Issue:1-2 Volume:99 Page:194-197
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Villain J.,Brueller O.S.,Qasim T.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference4 articles.

1. Fiedler Optoelektronik GmbH, Laserextensometer.

2. B. Ilschner, Hochtemperatur-Plastizität, Reine und angewandte Metallkunde in Einzeldarstellungen, Band 23, Springer, Berlin, 1973.

3. F. Vollertsen, S. Vogler, Werkstoffeigenschaften und Mikrostruktur, Carl Hanser Verlag, 1988.

4. J. Villain, T. Qasim, Comparison of the creep behaviour of lead-containing (60Sn–40Pb) and a lead-free solder alloy (96.5Sn–3.5Ag) at high homologous temperatures, in: Proceedings of the Third International Congress on Advances Materials, their Processes and Applications, 25–28 September 2000 (Materials Week), München, Germany.

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