Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity

Author:

Ishikawa Hiromasa1,Sasaki Katsuhiko1,Ohguchi Ken-ichi1

Affiliation:

1. Department of Mechanical Engineering II, Hokkaido University, Sapporo 060 Japan

Abstract

This paper treats the prediction of fatigue life of 60Sn-40Pb solder alloy using the plastic strain work density per unit time calculated from the proposed constitutive model for cyclic viscoplasticity. At first, in order to verify the applicability of the proposed constitutive model to the deformation of 60Sn-40Pb solder alloy, a series of basic experiments, such as creep tests and cyclic tension-compression loading tests are performed at 303K, 323K, 343K. Then, the proposed constitutive model is used to predict fatigue failure of the solder alloy. As a result, it is clarified that the proposed constitutive model is applicable to explain the viscous deformation of the solder alloy, and that its fatigue failure can be predicted using the plastic strain work density per unit time.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Chaboche J. L. , 1989, “Constitutive Equation for Cyclic Plasticity and Cyclic Viscoplasticity,” International Journal of Plasticity, Vol. 5, pp. 247–302.

2. Folke´, K. G. Odqvist, 1974, Material Theory of Creep and Creep Rupture, Oxford, Clarendon Press, pp. 10.

3. Freed A. D. , WalkerK. P., and VerrilliM. J., 1994, “Extending the Theory of Creep to Viscoplasticity,” ASME Journal of Pressure Vessel Technology, Vol. 116, pp. 67–75.

4. Freed A. D. , WalkerK. P., 1995, “Viscoplastic Model Development with an Eye Towards Characterization,” ASME J. Eng. Mater. Techno., Vol. 117, pp. 8–13.

5. Ishikawa. H. and Sasaki, K., 1987. “Constitutive Model of Cyclic Plasticity Considering Induced Anisotropy,” Constitutive Laws for Engineering Materials, ed. by Desai, C. S., et al., Elsevier, pp. 581–583.

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