An Experimental Investigation of the Effects of Cycling Frequency and Temperature on the Fatigue Life of 60 Tin/40 Lead Solder

Author:

Leece Gregory D.1,Miskioglu Ibrahim1,Nelson David A.1

Affiliation:

1. Mechanical Engineering, Engineering Mechanics Department, Michigan Technological University, Houghton, MI 49931-1295

Abstract

The effects of cycling frequency and temperature on the fatigue life of solder has been analyzed. Mechanical fatigue life experiments were conducted under load control while varying the temperature and cycling frequency. Using the experimental data, a fatigue model was formulated based on the Basquin and the Coffin-Manson relations, introducing the effects of temperature and frequency. The model parameters were obtained by a statistical method incorporating multiple linear regression. Using the model, estimated values of cycles to failure at each of the testing temperatures and frequency were calculated. Using the estimated values, an evaluation of each of the models was conducted, resulting in strong correlations between the model’s estimation and the experimental data.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Bannantine, J. A., Comer, J. J., and Handrock, J. L., 1980, Fundamentals of Metal Fatigue Analysis, Prentice-Hall, Inc., Englewood Cliffs, NJ.

2. Basquin O. H. , 1910, “The Exponential Law of Endurance Tests,” Am. Soc. Test. Mater. Proc., Vol. 10, pp. 625–630.

3. Burgess J. F. , CarlsonR. O., GlascockH. H., NeugebauerC. A., WebsterH. F., 1984, “Solder Fatigue Problems in Power Packages,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-7, No. 4, December, pp. 405–410.

4. Coffin L. F. , 1954, “A Study of the Effects of Cyclic Thermal Stresses on a Ductile Metal,” Transactions ASME, Vol. 76, pp. 931–950.

5. Lau, J. H., and Rice, D. W., 1985, “Solder Joint Fatigue in Surface Mount Technology: State of the Art,” Solid State Technology, October, pp. 91–101.

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