CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis-Reference-Cited by-同舟云学术

CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis

Published:2000-09-01 Issue:3 Volume:122 Page:255-261
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Pang John H. L.¹,Seetoh C. W.¹,Wang Z. P.²

Affiliation:

1. School of Mechanical and Production Engineering, Nanyang Technological University, Nanyang Drive, Singapore 639798

2. Gintic Institute of Manufacturing Technology, Nanyang Drive, Singapore 638075

Abstract

Three-dimensional nonlinear finite element analysis of a ceramic ball grid array (CBGA) package was conducted to determine the solder joint creep and plastic strain deformations in a simulated thermal cycling loading. Two methods of analysis were carried out to model the creep deformations during the dwell and during the temperature ramps in the thermal cycling loading. The equivalent plastic and creep strains are presented for the two analysis method to demonstrate the differences in the strain components. Both creep and plastic strain fatigue life prediction models were used to estimate the thermal cycling life of CBGA solder joints subjected to accelerated thermal cycling tests. The lives predicted using this nonlinear finite element analysis results were satisfactory and conservative compared to the experimental test results. [S1043-7398(00)01103-8]

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/122/3/255/5595588/255_1.pdf

Reference11 articles.

1. Lau, J. H., 1995, Ball Grid Array Technology, McGraw Hill.

2. Corbin, J. S. , 1993, “Finite Element Analysis for Solder Ball Connect (SBC) Structural Design Optimization,” IBM J. Res. Dev., 37, No. 5, Sept., pp. 585–596.

3. Guo, Yifan, and Corbin, J. S., 1995, “Reliability of Ceramic Ball Grid Array Assembly,” Chapter 8 of Ball Grid Array Technology, J. Lau, ed., McGraw-Hill, NY.

4. Barker, D. B., Gupta, V. K., and Cluff, K., 1993, “Solder Joint Crack Initiation and Crack Propagation in a TSOP using Strain Energy Partitioning,” ASME Adv. Electron. Packag., EEP-Vol. 4-2 pp. 943–949.

5. Mukai, M., Kawakami, T., Endo, T., Hiruta, Y., and Takahashhi, K., 1994, “Elastic-Creep Thermal Stress Analyses for the SMT-PGA Package’s Solder Joint,” ASME Mech. Mater. Electron. Packag., Vol. 2—Thermal and Mechanical Behaviour and Modelling , 2 pp. 197–203.

Cited by 35 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Machine learning aided modelling of thermomechanical fatigue of solder joints in electronic component assemblies;International Journal of Fatigue;2023-02

2. Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs);2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS);2021-08-09

3. Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies;Soldering & Surface Mount Technology;2021-07-22

4. Thermomechanical properties and fatigue life evaluation of SnAgCu solder joints for microelectronic power module application;Journal of Materials Research and Technology;2020-05

5. Stress and reliability analysis for interconnects;Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore;2020