Thermomechanical properties and fatigue life evaluation of SnAgCu solder joints for microelectronic power module application-Reference-Cited by-同舟云学术

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Thermomechanical properties and fatigue life evaluation of SnAgCu solder joints for microelectronic power module application

Published:2020-05 Issue:3 Volume:9 Page:5533-5541
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Huang Xiaoguang,Wang Zhiqiang,Yu Yanqun

Funder

China Scholarship Council

Fundamental Research Funds for the Central Universities of China

Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference34 articles.

1. Power electronic modules: design and manufacture;Sheng,2005

2. Power electronics: converters, applications, and design;Mohan,2003

3. Power cycling issues and challenges of SiC-MOSFET power modules in high temperature conditions;Ibrahim;Microelectron Reliab,2016

4. Design for reliability of power electronics modules;Lu;Microelectron Reliab,2009

5. Integrated numerical-experimental analysis of interfacial fatigue fracture in SnAgCu solder joints;Erinc;Int J Solids Struct,2007

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Correlations of microstructure and mechanical and thermal parameters of solder joints by X-ray CT and simulations;International Communications in Heat and Mass Transfer;2024-09

2. Microstructural response characteristics of SAC305/Cu column joint under friction embedded welding conditions;Materials Characterization;2024-05

3. Development of Creep Behavior of Lead-free Solders and Solder Joints in Electronic Interconnection;RARE METAL MAT ENG;2023

4. Study on the properties of low silver Sn1.0Ag0.5Cu composite solder reinforced with nickel-plated zinc oxide and its soldering joint;Materials Today Communications;2023-12

5. Thermal creep and fatigue failure of the sintered silver solder in a SiC-IGBT module under power cycling;Engineering Failure Analysis;2023-12

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