Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs)-Reference-Cited by-同舟云学术

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Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs)

Published:2021-08-09 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)
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Author:

Oukaira Aziz,Touati Djallel Eddine,Hassan Ahmad,Ali Mohamed,Savaria Yvon,Lakhssassi Ahmed

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9531648/9531647/09531747.pdf?arnumber=9531747

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Integrated Thermal Management Strategies for 3D Chip Stacking with Through-Silicon Vias (TSV);2024 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET);2024-05-16

2. Efficient Thermal Management Strategies for 3D-SiP Architectures;2024 18th International Conference on Ubiquitous Information Management and Communication (IMCOM);2024-01-03

3. Analytical and Numerical Modeling of the Thermal Performance of 3D System-in-Package (SiP);2023 International Conference on Electrical, Computer and Energy Technologies (ICECET);2023-11-16

4. Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology;Electronics;2023-07-20

5. Accurate On-Chip Thermal Peak Detection Based on Heuristic Algorithms and Embedded Temperature Sensors;Electronics;2023-07-06

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