Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology-Reference-Cited by-同舟云学术

Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology

Published:2023-07-20 Issue:14 Volume:12 Page:3154
ISSN:2079-9292
Container-title:Electronics
language:en
Short-container-title:Electronics

Author:

Oukaira Aziz¹^ORCID,Said Dhaou²^ORCID,Zbitou Jamal³⁴^ORCID,Lakhssassi Ahmed¹^ORCID

Affiliation:

1. Department of Engineering and Computer Science, University of Québec in Outaouais, Gatineau, QC J8X 3X7, Canada

2. Departement of Electrical and Computer Engineering, Université de Sherbrooke, Sherbrooke, QC J1K 2R1, Canada

3. LABTIC ENSA of Tangier, University of Abdelmalek Essaadi, Tétouan 93000, Morocco

4. ENSA of Tétouan, University of Abdelmalek Essaadi, Tétouan 93000, Morocco

Abstract

This paper introduces a novel approach to address thermal management challenges in system-in-package (SiP) technology, which is a significant concern in various advanced technologies. The main objective is to assess the electrical and thermal performance of the SiP model by utilizing Chip Cooling Laminate Chip (CCLC) technology. To achieve this, we employed finite element method (FEM) analysis using COMSOL Multiphysics® and MATLAB® to compare the results of electrical and thermal SiP models with and without CCLC technology. The numerical simulations revealed that, as opposed to the traditional model, the temperature variation decreased significantly with a uniform temperature distribution when employing the CCLC technology. Additionally, the thermal conduction performance of the packaging system using CCLC demonstrated remarkable reliability and resolution with cost-effective micro-devices, particularly in micro-medicine applications. The analysis of the electrical and thermal models reported a maximum error between them of 1.15 ∘C.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering

Link

https://www.mdpi.com/2079-9292/12/14/3154/pdf

Reference43 articles.

1. Back-end-of-line compatible transistors for monolithic 3-D integration;Datta;IEEE Micro,2019

2. The 1 billion transistor processor: Who will be first?;Ho;Semicond. Int.,2003

3. Chen, M.F., Chen, F.C., Chiou, W.C., and Doug, C.H. (2019, January 28–31). System on integrated chips (SoIC (TM) for 3D heterogeneous integration. Proceedings of the IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA.

4. Oukaira, A., Said, D., Zbitou, J., and Lakhssassi, A. (2023, January 3–5). Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC). Proceedings of the IEEE International Conference on Ubiquitous Information Management and Communication (IMCOM), Seoul, Republic of Korea.

5. Oukaira, A., Said, D., Zbitou, J., and Lakhssassi, A. (2022, January 4–7). Transient Thermal Analysis of System-in-Package Technology by the Finite Element Method (FEM). Proceedings of the IEEE International Conference on Microelectronics (ICM), Casablanca, Morocco.

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation on the thermal characteristics of electronic system and prediction of chip temperature by machine learning;Nuclear Engineering and Technology;2024-08

2. Symmetry Implications of a 60 GHz Inverted Microstrip Line Phase Shifter with Nematic Liquid Crystals in Diverse Packaging Boundary Conditions;Symmetry;2024-06-25

3. Integrated Thermal Management Strategies for 3D Chip Stacking with Through-Silicon Vias (TSV);2024 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET);2024-05-16

4. Design and Simulation of a System-in-Package Chip for Combined Navigation;Micromachines;2024-01-23

5. Efficient Thermal Management Strategies for 3D-SiP Architectures;2024 18th International Conference on Ubiquitous Information Management and Communication (IMCOM);2024-01-03