Transient Thermal Analysis of System-in-Package Technology by the Finite Element Method (FEM)-Reference-Cited by-同舟云学术

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Transient Thermal Analysis of System-in-Package Technology by the Finite Element Method (FEM)

Published:2022-12-04 Issue: Volume: Page:
ISSN:
Container-title:2022 International Conference on Microelectronics (ICM)
language:
Short-container-title:

Author:

Oukaira Aziz¹,Said Dhaou²,Zbitou Jamal³,Lakhssassi Ahmed¹

Affiliation:

1. Université du Québec en Outaouais,Departement of Electrical and Computer Engineering,Gatineau,Canada,J8Y 3G5

2. Université de Sherbrooke,Departement of Electrical and Computer Engineering,Sherbrooke,Canada,J1K 2R1

3. University of Abdelmalek Essaadi,LABTIC, ENSA of Tangier,Tangier,Morocco,BP 1818

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10005313/10005321/10005514.pdf?arnumber=10005514

Reference21 articles.

1. Molding Compound and Underfill Material Sets For A Molded Flip-Chip SIP Package

2. A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces

3. Thermal design methodology for electronic systems

4. Thermal management and concurrent system design of a wearable multicomputer

5. Simulation and validation of thermal stability for complex system design high power dissipation

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design and Simulation of a System-in-Package Chip for Combined Navigation;Micromachines;2024-01-23

2. Efficient Thermal Management Strategies for 3D-SiP Architectures;2024 18th International Conference on Ubiquitous Information Management and Communication (IMCOM);2024-01-03

3. Thermal camera for System-in-Package (SiP) technology: Transient thermal analysis based on FPGA and Finite Element Method (FEM);AEU - International Journal of Electronics and Communications;2023-12

4. Analytical and Numerical Modeling of the Thermal Performance of 3D System-in-Package (SiP);2023 International Conference on Electrical, Computer and Energy Technologies (ICECET);2023-11-16

5. Transient Dose Rate Effect Between System-in-Package and Printed Circuit Boards: A Comparative Experimental Study;IEEE Transactions on Nuclear Science;2023-08

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