Author:
Olenev Leonid Anatolevich,Zakieva Rafina Rafkatovna,Smirnova Nina Nikolaevna,Shichiyakh Rustem Adamovich,Ershov Kirill Aleksandrovich,Geetha Nisith
Abstract
Purpose
This study aims to present a more accurate lifetime prediction model considering solder chemical composition.
Design/methodology/approach
Thermal cycling and standard creep tests as well as finite element simulation were used.
Findings
The study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved.
Originality/value
It is confirmed.
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
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