Solder Joint Geometry Effects on Thermomechanical Fatigue Lifetime of End-Capped Chip Component Assemblies-Reference-Cited by-同舟云学术

Solder Joint Geometry Effects on Thermomechanical Fatigue Lifetime of End-Capped Chip Component Assemblies

Published:2024-01 Issue:1 Volume:14 Page:130-139
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Voet Vincent¹^ORCID,De Fruytier Christophe²,Pardoen Thomas¹^ORCID,Simar Aude¹

Affiliation:

1. Institute of Mechanics, Materials and Civil Engineering, IMAP, UCLouvain, Louvain-la-Neuve, Belgium

2. Thales Alenia Space Belgium, Mont-sur-Marchienne, Belgium

Funder

Service Public de Wallonie-Wallonie recherche through the project “Stress”

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

Reference36 articles.

1. Fatigue properties of solder joints;Wild;Welding Res. Suppl., Welding Res. Council,1972

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

2. Comparative study of lead-free alloys submitted to thermomechanical ageing;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07