Two-step sub-modeling framework for thermomechanical fatigue analysis of solder joints in DRAM module

Author:

Lee Hyun Suk,Yun Giseok,Song Ju-Hwan,Kim Do-Nyun

Funder

SK Hynix Inc

Publisher

Elsevier BV

Reference41 articles.

1. Reliability of Plastic Ball Grid Array Assembly, Ball Grid Array Technology;Darveaux,1995

2. Solder joint fatigue life model;Darveaux,1997

3. Solder joint fatigue models: review and applicability to chip scale packages;Lee;Microelectron. Reliab.,2000

4. Effect of simulation methodology on solder joint crack growth correlation and fatigue life prediction;Darveaux;J. Electron. Packag.,2002

5. Implementation of and extensions to Darveaux's approach to finite-element simulation of BGA solder joint reliability;Johnson,1999

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