Effects of Package Warpage on Head-in-Pillow Defect-Reference-Cited by-同舟云学术

Effects of Package Warpage on Head-in-Pillow Defect

Published:2015 Issue:7 Volume:56 Page:1037-1042
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Zhao Zhenyu¹,Chen Chuan²,Park Chang Yong³,Wang Yuming⁴,Liu Lei¹,Zou Guisheng¹,Cai Jian²,Wang Qian²

Affiliation:

1. Department of Mechanical Engineering, Tsinghua University

2. Institute of Microelectronics, Tsinghua University

3. Samsung Electronics Co. Ltd

4. Training Center for Basic Industry, Tsinghua University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/56/7/56_MI201404/_pdf

Reference21 articles.

1. 1) H. J. Albrecht and J. Gamalski: Microelectron. Int. 14 (1997) 21–30.

2. 2) J. Y. Deletage, F. J. M. Verdier, B. Plano, Y. Deshayes, L. Bechou and Y. Danto: Microelectron. Reliab. 43 (2003) 1137–1144.

3. 3) C. Oliphant, B. Christian, K. Subba-Rao, F. Doyle, L. Turbini, D. Connell and J. Q. L. Han: IPC APEX EXPO Technical Conference 2010, (IPC-Association Connecting Electronics Industries, Las Vegas, NV, United states, 2010) pp. 2461–2483.

4. 4) R. Pandher, N. Jodhan, R. Raut and M. Liberatore: 12th Electronics Packaging Technology Conference, (IEEE Computer Society, Singapore, 2010) pp. 151–156.

5. 5) Y. Liu, M. S. Pamela Fiacco and N. Lee: Proc. Electronic Components and Technology Conference, (Institute of Electrical and Electronics Engineers Inc., Las Vegas, NV, United states, 2010) pp. 451–455.

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