Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations-Reference-Cited by-同舟云学术

Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations

Published:2003-07 Issue:7 Volume:43 Page:1137-1144
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Delétage J.-Y.,Verdier F.J.-M.,Plano B.,Deshayes Y.,Bechou L.,Danto Y.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

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3. Engelmaier W. Functional cycles and surface mounting attachment reliability. ISHM Technical Monograph Series 6984-002, ISHM, Silver Spring, MD, 1984. p. 87–114

4. Reliability of Controlled Collapse Interconnections

5. Hijazi A. Etude du comportement thermomécanique et de la fiabilité d’assemblages de CMS utilisés en environnement automobile sévère. Thesis Université Bordeaux 1, February 1993

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