Comparison of Laser Soldering and Conventional Reflow Soldering Using Sn-58bi/Osp-Finished Cu Joints

Author:

Yoon Jeong-Won,Jeong Min-Seong,Lee Dong-Hwan

Publisher

Elsevier BV

Subject

General Earth and Planetary Sciences,General Environmental Science

Reference21 articles.

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4. Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing;Z Zhu;Microelectron. Reliab,2018

5. Effect of Joule heating and current crowding on electromigration in mobile technology;Y K N Tu;Appl. Phys. Rev,2017

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