700nm pitch Cu/SiCN wafer-to-wafer hybrid bonding-Reference-Cited by-同舟云学术

700nm pitch Cu/SiCN wafer-to-wafer hybrid bonding

Published:2022-12-07 Issue: Volume: Page:
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Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
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Author:

Chew Soon-Aik¹,Iacovo Serena¹,Fordor Ferenc¹,Dewilde Sven¹,Devriendt Katia¹,De Vos Joeri¹,Miller Andy¹,Beyer Gerald¹,Beyne Eric¹

Affiliation:

1. IMEC,Leuven,Belgium

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013108.pdf?arnumber=10013108

Reference10 articles.

1. Ultra-fine Pitch 3D integration Using Face-to-Face Hybrid Bonding Wafer Bonding Combines with a Via-Middle Through-Silicon-Via Process;kim;ECTC,2016

2. 3D SoC integration, beyond 2.5D chiplets

3. Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects

4. Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics

5. W2W permanent stacking for 3D system integration;lan;Proc IEEE Symp Elec Pack Tech Conf (EPTC 16th),2014

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