Nanotwinned copper electroplating with halide engineered grain morphologies-Reference-Cited by-同舟云学术

Nanotwinned copper electroplating with halide engineered grain morphologies

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
language:
Short-container-title:

Author:

Peng Zhen-Jia¹,Dong Yi²,Li Zhe²,Fu Xian-Zhu³,Liu Zhi-Quan²,Sun Rong²

Affiliation:

1. Chinese Academy of Sciences (CAS),Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China,518055

2. Shenzhen Institute of Advanced Electronic Materials,Shenzhen Institute of Advanced Technology, CAS,Shenzhen,China,518055

3. Shenzhen University,College of Materials Science and Engineering,Shenzhen,China,518055

Funder

Innovation Fund

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873345.pdf?arnumber=9873345

Reference28 articles.

1. Bottom–Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via

2. Synergistic effects of gelatin and convection on copper foil electrodeposition

3. Effects of cetyltrimethylammonium bromide (CTAB) on electroplating twin-structured copper interconnects

4. Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition

5. Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ad/desorption mechanism of amine-terminated polyoxypropylene suppressor in advanced acid copper electroplating;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. Copper electroplating of through silicon vias (TSV) using a series of nitrogen-containing heterocyclic compounds;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

3. Effects of additive interactions on electroplating profile of IC substrate copper pillars;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

4. Regulating the orientation and distribution of nanotwins by trace of gelatin during direct current electroplating copper on titanium substrate;Journal of Materials Science;2022-09-28