Effects of additive interactions on electroplating profile of IC substrate copper pillars-Reference-Cited by-同舟云学术

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Effects of additive interactions on electroplating profile of IC substrate copper pillars

Published:2023-08-08 Issue: Volume:10 Page:1-6
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Li Xiao¹,Li Zhe²,Gao Li-Yin²,Sun Rong²,Liu Zhi-Quan²

Affiliation:

1. Chinese Academy of Sciences (CAS),Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China,518055

2. Shenzhen Institute of Advanced Technology, CAS,Shenzhen Institute of Advanced Electronic Materials,Shenzhen,China,518055

Funder

Research and Development

Innovation Fund

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492428.pdf?arnumber=10492428

Reference25 articles.

1. High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF)

2. Method to Improve the Process Efficiency for Copper Pillar Electroplating

3. Severe embrittlement of copper pillar bumps electrodeposited using JGB as leveler

4. Nanotwinned copper electroplating with halide engineered grain morphologies

5. Effects of cetyltrimethylammonium bromide (CTAB) on electroplating twin-structured copper interconnects

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