Method to Improve the Process Efficiency for Copper Pillar Electroplating-Reference-Cited by-同舟云学术

Method to Improve the Process Efficiency for Copper Pillar Electroplating

Published:2015-12-09 Issue:3 Volume:163 Page:E39-E42
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Luo Victor,Xue Xing-Tao,Yu Kuan-Chieh,Meng Jin,Lu Hong-Liang,Zhang David Wei

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Intermetallic Formation of Copper Pillar With Sn–Ag–Cu for Flip-Chip-On-Module Packaging

2. An RDL UBM Structural Design for Solving Ultralow-K Delamination Problem of Cu Pillar Bump Flip Chip BGA Packaging

3. High Coplanarity and Fine Pitch Copper Pillar Bumps Fabrication Method

4. Plating Uniformity of Bottom-up Copper Pillars and Patterns for IC Substrates with Additive-assisted Electrodeposition

5. Flack W. W. Nguyen H. A. , IEEE 12th Advanced Packaging Materials Symposium, 208 (2007).

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