High Coplanarity and Fine Pitch Copper Pillar Bumps Fabrication Method-Reference-Cited by-同舟云学术

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High Coplanarity and Fine Pitch Copper Pillar Bumps Fabrication Method

Published:2010-06-21 Issue:6 Volume:49 Page:06GN07
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Huang Jung-Tang,Hsu Hou-Jun,Lee Kuo-Yu,Tsai Ting-Chiang,Chen Ching-Kong

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference5 articles.

1. A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist

2. Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating

3. Optical proximity correction for a versatile LCD based direct write maskless photoplotter

4. Surface modification on plating-based Cu/Sn/0.7Cu lead-free copper pillars by using polishing

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electroless deposition of high-uniformity nickel microbumps with ultrahigh resolution of 8 μm pitch for monolithic Micro-LED display;Materials Science in Semiconductor Processing;2024-06

2. Electroless deposition of nickel microbumps for fine-pith flip-chip bonding;Journal of Physics: Conference Series;2024-06-01

3. Method to Improve the Process Efficiency for Copper Pillar Electroplating;Journal of The Electrochemical Society;2015-12-09

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