Author:
Hsu Hou jun,Huang Jung Tang,Chao Pe Shan,Shih Sheng Hsiung
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference21 articles.
1. Richard Ball, Electronics Weekly (27.01.06).
2. Electromigration Effect on Cu-pillar(Sn) Bumps
3. Lau Kee Kwang, Tan Kim Hwee, Advanced Solutions Pte. Ltd. (APS) Singapore, 2.
Cited by
4 articles.
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