Author:
Rao Vempati Srinivasa,Kripesh Vaidyanathan,Yoon Seung Wook,Tay Andrew A O
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Cited by
35 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Fabrication of high-aspect-ratio stepped Cu microcolumn array using UV-LIGA technology;Microsystem Technologies;2023-06-17
2. Thick Film Photoresist Process for Copper Pillar Bumps on Surface Acoustic Wave - Wafer Level Packages;2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC);2020-09-15
3. MEMS lithography;Handbook of Silicon Based MEMS Materials and Technologies;2020
4. A thick photoresist process for high aspect ratio MEMS applications;32nd European Mask and Lithography Conference;2016-10-20
5. MEMS Lithography;Handbook of Silicon Based MEMS Materials and Technologies;2015