An RDL UBM Structural Design for Solving Ultralow-K Delamination Problem of Cu Pillar Bump Flip Chip BGA Packaging-Reference-Cited by-同舟云学术

An RDL UBM Structural Design for Solving Ultralow-K Delamination Problem of Cu Pillar Bump Flip Chip BGA Packaging

Published:2014-08-20 Issue:11 Volume:43 Page:4229-4240
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chen K. M.,Wu C. Y.,Wang C. H.,Cheng H. C.,Huang N. C.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-014-3332-x.pdf

Reference20 articles.

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3. M. Huang, O.G. Yeow, C.Y. Poo, and T. Jiang, IEEE Trans. Compon. Packag. Technol. 31, 767 (2008).

4. Y.S. Lai, Y.T. Chiu, C.W. Lee, and Y. H. Shao, 58th Electronic Components and Technology Conference (ECTC), USA (May 2008), pp. 330–335.

5. Y. Orii, K. Toriyama, S. Kohara, and H. Noma, 61st Electronic Components and Technology Conference (ECTC), USA (May 2011), pp. 340–345.

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