Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction
Author:
Funder
Universiti Sains Malaysia
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s11664-023-10855-3.pdf
Reference49 articles.
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2. C.S. Lau and M.Z. Abdullah, Simulation investigations on fluid/structure interaction in the reflow soldering process of board-level BGA packaging. Int. J. Comput. Theory Eng. 5(4), 645 (2013).
3. C. Morando and O. Fornaro, Thermal properties of sn-based solder alloys. J. Mater. Sci. Mater. Electron. 25, 3440 (2014).
4. F. Peng, W. Liu, Y. Ma, C. Liang, Y. Huang, and S. Tang, Microstructure of Sn-20In-2.8Ag solder and mechanical properties of joint with Cu. Solder. Surf. Mt. Technol. 31(1), 1 (2019).
5. L. Liu, X. Zhao, P. Chen, Y. Liu, Y. Wang, W. Chen, and J. Wu, Effects of α-Fe2O3 additions on assembly reliability of electroplated Sn-based solder cap on Cu pillar bump during thermal cycling. J. Electron. Mater. 48, 1079 (2019).
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