Simulation Investigations on Fluid/Structure Interaction in the Reflow Soldering Process of Board-Level BGA Packaging
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Publisher
IACSIT Press
Link
http://www.ijcte.org/papers/767-A005.pdf
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction;Journal of Electronic Materials;2023-12-12
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4. A review on numerical approach of reflow soldering process for copper pillar technology;The International Journal of Advanced Manufacturing Technology;2022-07-18
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