Funder
Universiti Sains Malaysia
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference41 articles.
1. M. Datta, Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: an overview. J. Micromanuf. 3(1), 69–83 (2020).
2. M.I. Ahmad, M.S. Abdul Aziz, M.Z. Abdullah, M. Salleh, M.A. Anuar, M.H.H. Ishak, W. Rahiman, and M. Nabiałek, Investigations of infrared desktop reflow oven with FPCB substrate during reflow soldering process. Metals. 11(8), 1155 (2021).
3. T.N. Tsai, Modeling and optimization of reflow thermal profiling operation: a comparative study. J. Chinese Inst. Ind. Eng. 26(6), 480–492 (2009).
4. W.N.C. Weng, in Recent Prog. Solder. Mater., ed. by M. A. A. Mohd Salleh, M. S. Abdul Aziz, A. Jalar, M. I. Izwan Ramli (IntechOpen, London, United Kingdom, 2017), p. 91–108.
5. H. Yu and J. Kivilathti, CFD modelling of the flow field inside a reflow oven. Solder. Surf. Mt. Technol. 14(1), 38–44 (2002).
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