Author:
Liao Xiaoru,Li Zhen,Tan Baizhao,Luo Jiye,Shi Daniel
Publisher
Science China Press., Co. Ltd.
Subject
Materials Chemistry,General Chemical Engineering,Biochemistry,General Chemistry
Reference104 articles.
1. Kondo K, Akolkar RN, Barkey DP, Yokoi M, Copper Electrodeposition for Nanofabrication of Electronics Devices, Berlin:Springer, 2014.
2. Damascene copper electroplating for chip interconnections
3. Akolkar R, Wandelt K. Encyclopedia of Interfacial Chemistry. 2018: 24–31.
4. Jin L, Tian Z, Yang F, Yang J, Zhan D, Zhou S. Electrochimica Acta, 2020, 26: 521–530 (in Chinese) [金磊, 田中群, 杨防祖, 杨家强, 詹东平, 周绍民. 电化学, 2020, 26: 521–530].
5. A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process