Ad/desorption mechanism of amine-terminated polyoxypropylene suppressor in advanced acid copper electroplating-Reference-Cited by-同舟云学术

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Ad/desorption mechanism of amine-terminated polyoxypropylene suppressor in advanced acid copper electroplating

Published:2023-08-08 Issue: Volume: Page:1-6
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Zhang Ning¹,Li Zhe²,Wang Rui-Xun²,Liu Zhi-Quan²,Sun Rong²

Affiliation:

1. Chinese Academy of Sciences (CAS),Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology,Shenzhen,China,518055

2. CAS,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China,518055

Funder

Research and Development

Innovation Fund

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492293.pdf?arnumber=10492293

Reference17 articles.

1. Inhibition Due to the Interaction of Polyethylene Glycol, Chloride, and Copper in Plating Baths: A Surface-Enhanced Raman Study

2. PEG, PPG, and Their Triblock Copolymers as Suppressors in Copper Electroplating

3. Acceleration Kinetics of PEG, PPG, and a Triblock Copolymer by SPS during Copper Electroplating

4. Using a triblock copolymer as a single additive in high aspect ratio through silicon via (TSV) copper filling

5. Extended tight‐binding quantum chemistry methods

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