Inhibition Due to the Interaction of Polyethylene Glycol, Chloride, and Copper in Plating Baths: A Surface-Enhanced Raman Study-Reference-Cited by-同舟云学术

Inhibition Due to the Interaction of Polyethylene Glycol, Chloride, and Copper in Plating Baths: A Surface-Enhanced Raman Study

Published:2003-07-24 Issue:35 Volume:107 Page:9415-9423
ISSN:1520-6106
Container-title:The Journal of Physical Chemistry B
language:en
Short-container-title:J. Phys. Chem. B

Author:

Feng Z. Vivian¹,Li Xiao¹,Gewirth Andrew A.¹

Affiliation:

1. Department of Chemistry and Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Surfaces, Coatings and Films,Physical and Theoretical Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/jp034875m

Reference53 articles.

1. Stafford, G.; Moffat, T.; Javic, V.; Kelley, D.; Bonevich, J.; Josell, D.; Vaudin, M.; Armstrong, N.; Huber, W.; Stainshevsky, A.Cuelectrodeposition for on-chip interconnections, 1st ed.; Seiler, D. G., Diebold, A. C., Shaffner, T. J., McDonald, R., Bullis, W. M., Smith, P. J., Secular, E. M., Eds.; Springer-Verlag: Berlin, 2000; pp 402−406.

2. Dini, J. W.Electrodeposition of Cu, 4th ed.; Schlesinger, M., Paunovic, M., Eds.; John Wiley & Sons: New York, 2000; pp 61−119.

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