Novel suppressor for damascene copper electrodeposition: Thioether-modified polyether with enhanced adsorption through an adjustable synthesis strategy-Reference-Cited by-同舟云学术

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Novel suppressor for damascene copper electrodeposition: Thioether-modified polyether with enhanced adsorption through an adjustable synthesis strategy

Published:2024-11 Issue: Volume:503 Page:144912
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Zhang Yue,Chen Junye^ORCID,Cheng Yuanrong,Han Shuo^ORCID,Xiao Fei^ORCID

Publisher

Elsevier BV

Reference53 articles.

1. Damascene copper electroplating for chip interconnections;Andricacos;IBM. J. Res. Dev.,1998

2. Materials quest for advanced interconnect metallization in integrated circuits;Moon;Adv. Sci.,2023

3. Effect of Cl− on the adsorption–desorption behavior of PEG;Wang;J. Electrochem. Soc.,2008

4. Roles of chloride ion in microvia filling by copper electrodeposition: II. Studies using EPR and galvanostatic measurements;Dow;J. Electrochem. Soc.,2005

5. Inhibition due to the interaction of polyethylene glycol, chloride, and copper in plating baths: A surface-enhanced raman study;Feng;J. Phys. Chem. B.,2003

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