Funder
China National Funds for Distinguished Young Scientists
National Natural Science Foundation of China
Reference55 articles.
1. Damascene copper electroplating for chip interconnections;Andricacos;IBM J. Res. Dev.,1998
2. L.J. Brogan, Y. Liu, M.M. Huie, J.D. Reid, J. Kelly, H.k. Shobha, H. Huang, K. Motoyama, C.-k. Hu, Improved copper Damascene wires using direct plate on cobalt process, Electrochemical Society Meeting Abstracts 235, The Electrochemical Society, Inc., 2019, pp. 1055-1055.
3. S.-T. Chen, N.A. Lanzillo, S. Van Nguyen, T. Nogami, A.H. Simon, Interconnect Processing: Integration, Dielectrics, Metals, Springer Handbook of Semiconductor Devices, Springer2022, pp. 169-218.
4. High-aspect-ratio copper via filling used for three-dimensional chip stacking;Sun;J. Electrochem. Soc.,2003
5. Semiconductor advanced packaging;Lau;Springer Nature,2021