Synergistic effects of gelatin and convection on copper foil electrodeposition
Author:
Funder
National Natural Science Foundation of China
111 Project
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference49 articles.
1. Effects of deposition modes on the microstructure of copper deposits from an acidic sulfate bath
2. Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives
3. Influence of organic additives on the initial stages of copper electrodeposition on polycrystalline platinum
4. Formalin solution and acetone as organic additives in electrodeposition of copper
5. Electrodeposition of Copper in the SPS-PEG-Cl Additive System
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